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| Series (left) and parallel (right) arrangements of N-MOSFETs. |
Yes, MOSFETs can be connected in series to handle higher voltages, essentially allowing the total drain-source voltage (\(V_{DS}\)) to be shared across multiple devices. This configuration is used to increase the overall voltage rating beyond what a single MOSFET can handle, though it requires careful design to ensure voltage balancing during switching.
Key Considerations for Series Connection:
- Voltage Sharing: To prevent one MOSFET from bearing the entire voltage (due to variations in leakage current), voltage-balancing components—such as resistors or capacitors—must be used in parallel with each MOSFET.
- Gate Driving: Both (or all) MOSFETs must be switched ON and OFF simultaneously. This is often achieved through isolated gate drivers.
- Applications: Series MOSFETs are typically used for high-voltage switching, in push-pull arrangements, or as bidirectional switches when placed in "anti-series".
- Challenges: If not balanced correctly, unequal voltage distribution during turn-on/off transitions can lead to component failure.
While series connections increase the voltage capacity, they increase the total on-resistance (\(\text{R}_{\text{DS(on)}}\)), leading to higher conduction losses compared to a single device.
Can MOSFETs be used in Parallel connections?
Yes, MOSFETs can be connected in parallel to increase current capacity, decrease total on-resistance (\(R_{DS(on)}\)), and distribute heat. While this is common in high-power applications, it requires careful layout to ensure even current sharing and to avoid oscillations
Key Considerations for Parallel MOSFETs:
- Gate Resistors: Use individual gate resistors (\(R_{g}\)) for each MOSFET to prevent parasitic oscillations.
- Current Sharing: While MOSFETs have a positive temperature coefficient that aids in balancing, variations in threshold voltage (\(V_{GS(th)}\)) can cause current imbalance.
- Thermal Coupling: Paralleled devices should be kept at similar temperatures.
- Layout: Keep wiring symmetric and stray inductance low to avoid switching imbalances.
Deep dive
Parallel MOSFET Banks (Current Sharing)
- Purpose: To reduce total on-resistance ($R_{DS(on)}$.
- Advantages: MOSFETs have a positive temperature coefficient of $R_{DS(on)}$.
- Key Considerations:
- Current Imbalance: Discrepancies in $V_{th}$ (threshold voltage) and $R_{DS(on)}$ can cause uneven current sharing, especially during switching transitions.
- Gate Oscillation: Parallel MOSFETs can form a high-Q resonant circuit with stray inductance, resulting in parasitic oscillation.
- Mitigation: Use matched devices from the same production lot and include a small individual gate resistor for each MOSFET to dampen oscillation.
- Layout:.Maintain symmetrical PCB layouts for connections to ensure equal parasitic inductance.
Series MOSFET Banks (Voltage Sharing)
- Purpose: To handle voltages that exceed the rating of a single device.
- Advantages: Spreads switching losses and heat dissipation across multiple devices.
- Key Considerations:
- Voltage Balancing: Static and dynamic voltage sharing is critical to prevent one device from experiencing overvoltage.
- Driving Requirements: Each MOSFET in a series string typically requires an isolated gate driver, as the source terminals are not at a common potential.
- Protection: Diodes are often added to block voltage spikes.
Summary Comparison
| Feature | Parallel | Series |
|---|---|---|
| Main Goal | Higher Current | Higher Voltage |
| Connection | Source-Source, Drain-Drain | Drain-Source Chain |
| Self-Balancing | Yes (via $R_{DS(on)}$) | No (Requires balancing circuits) |
| Main Challenge | Parasitic Oscillation | Complex Gate Driving |
Design Tip:
| Benefits | Series | Parallel |
|---|---|---|
| Electrical | Spreads switching loss across multiple MOSFETs | Increases the total current that can be delivered to a load |
| Thermal | Spreads heat dissipation across multiple MOSFETs | Spreads heat dissipation across multiple MOSFETs |
